Semiconductor packaging
US4839716A · kind A · utility
43Cited by
31References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 1987 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | Jun 1, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a semiconductor package to prevent alpha radiation emitted from the sealing glass or other packaging components from impinging on the housed semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.