Process for sawing crystal rods or blocks into thin wafers

US4844047A · kind A · utility

Assignee

• Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

• Gerhard Brehm · Emmerting, DE
• Karlheinz Langsdorf · Burghausen, DE
• Johann Niedermeier · Burghausen, DE
• Johann Glas · Burghausen, DE

Key dates

• Filing date: Nov 19, 1987
• Grant date: Jul 4, 1989
• Expiry date: Nov 19, 2007

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23D59/02
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A process for the sawing of crystal rods or blocks into thin wafers by innal-hole saws is specified. In this process, the deviation of the saw blade from the intended cutting line, occurring in virtually every sawing operation, is countered by the force of a fluid being applied, at least periodically, to the side surfaces of the blade. This allows the force conditions in the saw cut and thus the deflection of the saw blade, to be influenced. This process results in an improved geometrical quality of the wafers obtained and in prolonged service life of the saw blades which have to be resharpened less often.