Low profile semiconductor package
US4845545A · kind A · utility
17Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 1987 |
| Grant date | Jul 4, 1989 |
| Priority date | — |
| Expiry date | Feb 13, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flat thin package for semiconductor die has rigid leads extending perpendicularly from its length which can be plugged into a printed circuit board socket. The package has a low profile above the surface of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.