Preparation of printed circuit boards by selective metallization
US4847114A · kind A · utility
17Cited by
24References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1988 |
| Grant date | Jul 11, 1989 |
| Priority date | — |
| Expiry date | Jun 1, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1415
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.