Heat resistant positive resists and method for preparing heat-resistant relief structures

US4849051A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Hellmut Ahne · Königsee, DE
• Albert Hammerschmidt · Erlangen, DE

Key dates

• Filing date: May 9, 1988
• Grant date: Jul 18, 1989
• Expiry date: May 9, 2008

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S430/156
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The invention provides heat-resistant positive resists and methods for preparing heat-resistant relief structures therefrom. The positive resists are based upon polybenzoxazole precursor stages and diazoquinones. The polybenzoxazole precursor stages are hydroxypolyamides with the following structure: ##STR1## where R, R*, R.sub.1 and R.sub.1 * are aromatic groups; n.sub.1 and n.sub.2 =1 to 100; and R.noteq.R* and/or R.sub.1 .noteq.R.sub.1 *.