Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor
US4849059A · kind A · utility
18Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1988 |
| Grant date | Jul 18, 1989 |
| Priority date | — |
| Expiry date | Sep 13, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S516/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Tin, lead or tin-lead alloy electroplating baths producing little or no foam during electroplating, even at conditions of high-speed plating using high current densities and/or vigorous bath circulation, are disclosed comprised of tin and/or lead salts of alkane sulfonic acids, free alkane sulfonic acid, brightening agent, a deforming agent comprised of silicone and silica and/or a silicate in polypropylene glycol, a first nonionic surfactant consisting of an ethoxylated arylphenol and a second nonionic surfactant consisting of an ethoxylated short-chain alcohol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.