Semiconductor card which can be folded
US4849617A · kind A · utility
77Cited by
7References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 17, 1987 |
| Grant date | Jul 18, 1989 |
| Priority date | — |
| Expiry date | Mar 17, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/077
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thin semiconductor card, such as an IC card, includes a card main body, and a semiconductor module mounted therein. A foldable part or member is provided permitting the card main body to be folded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.