Tetsuya Ueda
109Patents
23h-index
143Co-inventors
93Inventor score
Filing activity: Mar 17, 1987 → Nov 29, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5125358A | Microwave plasma film deposition system | Electricity | 331 | Expired |
| US5592019A | Semiconductor device and module | Electricity | 290 | Expired |
| US5969426A | Substrateless resin encapsulated semiconductor device | Electricity | 199 | Expired |
| US4849617A | Semiconductor card which can be folded | Physics | 77 | Expired |
| US5760429A | Multi-layer wiring structure having varying-sized cutouts | Electricity | 69 | Expired |
| US6071755A | Method of manufacturing semiconductor device | Electricity | 64 | Expired |
| US5031026A | Thin semiconductor card | Physics | 62 | Expired |
| US4949158A | Semiconductor device | Electricity | 57 | Expired |
| US5334872A | Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad | Electricity | 57 | Expired |
| US5004899A | Semiconductor card which can be folded | Physics | 57 | Expired |
| US5157478A | Tape automated bonding packaged semiconductor device incorporating a heat sink | Electricity | 53 | Expired |
| US5576247A | Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture | Emerging Cross-Sectional Technologies | 38 | Expired |
| US7473632B2 | Semiconductor device with an air gap between lower interconnections and a connection portion to the lower interconnections not formed adjacent to the air gap | Electricity | 36 | Active |
| US5083191A | Semiconductor device | Electricity | 34 | Expired |
| US5327012A | Semiconductor device having a double-layer interconnection structure | Electricity | 33 | Expired |
| US4838804A | Mechanism for connecting IC card and external device | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5385867A | Method for forming a multi-layer metallic wiring structure | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5166099A | Manufacturing method for semiconductor device | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5064706A | Carrier tape including molten resin flow path element for resin packaged semiconductor devices | Emerging Cross-Sectional Technologies | 29 | Expired |
| US4864116A | Mechanism for connecting an IC card to an external device | Electricity | 29 | Expired |
| US4865193A | Tape carrier for tape automated bonding process and a method of producing the same | Electricity | 28 | Expired |
| US5134093A | Method of fabricating a semiconductor device including a protective layer | Emerging Cross-Sectional Technologies | 27 | Expired |
| US4764803A | Thin semiconductor card | Physics | 26 | Expired |
| US6252427A | CMOS inverter and standard cell using the same | Electricity | 23 | Expired |
| US5309021A | Semiconductor device having particular power distribution interconnection arrangement | Emerging Cross-Sectional Technologies | 23 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.