Electronic package with improved heat sink
US4849856A · kind A · utility
84Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1988 |
| Grant date | Jul 18, 1989 |
| Priority date | — |
| Expiry date | Jul 13, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant members (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.