Heat dissipating interconnect tape for use in tape automated bonding
US4849857A · kind A · utility
77Cited by
24References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1987 |
| Grant date | Jul 18, 1989 |
| Priority date | — |
| Expiry date | Oct 5, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to an interconnect tape for TAB and electronic packages made from the tape. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heatsink. The tape leads, the heat dissipating pad and the support members for the heat dissipating pad are all formed from the same electrically conductive strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.