Cathode and target design for a sputter coating apparatus
US4855033A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 10, 1987 |
| Grant date | Aug 8, 1989 |
| Priority date | — |
| Expiry date | Sep 10, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3497
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved cathode and sputtering target design for sputter coating, permitting operation with larger cathodes and at higher power levels than heretofore possible. The cathode and target assembly includes a cathode body, a target holder, and a sputtering target. The cathode body functions as a magnetic pole piece, a portion of the cooling system, and a mechanical stabilizer for the target. The target holder also provides cooling, by means of cooling passages and by intermeshing cooling means in contact with the target. The sputtering target has an arch-like face that promotes a controlled plastic deformation in a preselected direction, so that heat-induced expansion during operation results in the target being urged into forceful, intimate contact with at least two cooled surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.