Orthogonal chip mount system module and method
US4855809A · kind A · utility
64Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1987 |
| Grant date | Aug 8, 1989 |
| Priority date | — |
| Expiry date | Nov 24, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An orthogonal chip mount system module (10) comprising a base module (12), an interconnect chip (14), orthogonal slots (16) and semiconductor chips (18) is provided. The interconnect chip (14) is fixed to the base module (12) by high thermal conductivity epoxy. The semiconductor chips (18) are interference fitted into the slots (16). Solder pads (20) on the semiconductor chips (18) are aligned with solder pads (22) on the interconnect chip (14) and the system module (10) is then heated to the reflow temperature of the solder forming joints (24).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.