Apparatus for measuring an adhesion force of a thin film
US4856326A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 1988 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Jul 26, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0605
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for measuring the adhesion force of a thin film deposited on a substrate of a specimen. The apparatus comprises an inclining mechanism for mounting a sample dish with a specimen inclined by a predetermined angle with respect to the sample dish, an indentor disposed above the specimen for deforming the specimen by indentation, a driver for driving the indentor perpendicular to the sample dish, a load transducer for measuring a load applied to the specimen by the indentor, a sensor for sensing propagation of a crack produced in the specimen by the load, a displacement gage interlocked with the driver for measuring a penetration depth of the indentor, and a measuring mechanism for measuring the adhesion force of the thin film to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.