Lead frame for enclosing semiconductor chips with resin
US4862586A · kind A · utility
21Cited by
7References
6Claims
0Family size
Inventor
Key dates
| Filing date | Feb 5, 1988 |
| Grant date | Sep 5, 1989 |
| Priority date | — |
| Expiry date | Feb 5, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame for enclosing a semiconductor chip with resin has a plurality of leads and at least one side frame member for supporting the leads. The lead frame is formed at a required location with a resin adhering portion for effectively removing resin and fins solidified in the air vent of a molding apparatus and formed between the lead frame and the dies of the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.