Method of making a flexible interconnect
US4862588A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 21, 1988 |
| Grant date | Sep 5, 1989 |
| Priority date | — |
| Expiry date | Jul 21, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a flexible interconnect for connection between stacks of electronic components. The method includes punching a plurality of holes through a flexible insulating material, plating copper studs into the holes extending out of at least one side and preferably both sides of the flexible material, and electrically interconnecting some of the plated studs by interconnects supported by the flexible material. The interconnects may be supported from the outside of the flexible material or embedded therein. Dummy studs may be provided in the flexible material extending to the outside and aligned with studs extending on the other side of the insulating material which are connected to the electrical interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.