Microelectronic & Computer Technology Corporation
192Patents
0Active
192Granted
45Portfolio score
Filing activity: Mar 31, 1986 → Sep 5, 2001
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5339391A | Computer display unit with attribute enhanced scroll bar | Physics | 284 | Expired |
| US5021976A | Method and system for generating dynamic, interactive visual representations of information structures within a computer | Physics | 227 | Expired |
| US5173442A | Methods of forming channels and vias in insulating layers | Emerging Cross-Sectional Technologies | 188 | Expired |
| US5500905A | Pattern recognition neural network with saccade-like operation | Physics | 186 | Expired |
| US6529377B1 | Integrated cooling system | Emerging Cross-Sectional Technologies | 180 | Expired |
| US4984358A | Method of assembling stacks of integrated circuit dies | Emerging Cross-Sectional Technologies | 179 | Expired |
| US5388068A | Superconductor-semiconductor hybrid memory circuits with superconducting three-terminal switching devices | Emerging Cross-Sectional Technologies | 174 | Expired |
| US5379191A | Compact adapter package providing peripheral to area translation for an integrated circuit chip | Electricity | 158 | Expired |
| US4758926A | Fluid-cooled integrated circuit package | Electricity | 156 | Expired |
| US4926241A | Flip substrate for chip mount | Electricity | 148 | Expired |
| US4991290A | Flexible electrical interconnect and method of making | Emerging Cross-Sectional Technologies | 138 | Expired |
| US5227013A | Forming via holes in a multilevel substrate in a single step | Emerging Cross-Sectional Technologies | 136 | Expired |
| US5509071A | Electronic proof of receipt | Physics | 126 | Expired |
| US5199918A | Method of forming field emitter device with diamond emission tips | Electricity | 123 | Expired |
| US4871316A | Printed wire connector | Electricity | 119 | Expired |
| US5508228A | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Emerging Cross-Sectional Technologies | 118 | Expired |
| US5219787A | Trenching techniques for forming channels, vias and components in substrates | Electricity | 118 | Expired |
| US5289346A | Peripheral to area adapter with protective bumper for an integrated circuit chip | Emerging Cross-Sectional Technologies | 118 | Expired |
| US5091339A | Trenching techniques for forming vias and channels in multilayer electrical interconnects | Emerging Cross-Sectional Technologies | 114 | Expired |
| US5170930A | Liquid metal paste for thermal and electrical connections | Electricity | 104 | Expired |
| US5328087A | Thermally and electrically conductive adhesive material and method of bonding with same | Emerging Cross-Sectional Technologies | 103 | Expired |
| US5116463A | Detecting completion of electroless via fill | Electricity | 103 | Expired |
| US5449970A | Diode structure flat panel display | Electricity | 102 | Expired |
| US5071518A | Method of making an electrical multilayer interconnect | Electricity | 101 | Expired |
| US5078852A | Plating rack | Chemistry; Metallurgy | 98 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.