Surface roughening of ceramics and application to production of ceramic wiring board
US4867843A · kind A · utility
2Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1988 |
| Grant date | Sep 19, 1989 |
| Priority date | — |
| Expiry date | Sep 28, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A surface of ceramic plate is roughened uniformly by immersing in a mixed solution comprising NH.sub.4 F, (NH.sub.4).sub.2 SO.sub.4, H.sub.2 SO.sub.4 and H.sub.2 O, followed by immersion in molten NaOH, and the resulting surface roughened ceramic plate can be used for producing a ceramic wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.