IC-packaged device
US4868634A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1988 |
| Grant date | Sep 19, 1989 |
| Priority date | — |
| Expiry date | Feb 22, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC-packaged device comprises a lower plate which has wiring patterns at least on an upper surface; an upper plate which has upper surface wiring patterns and at least an opening hole and are superimposed on the lower plate when used; and a plurality of IC chips which has a lot of connecting terminal groups mounted on the upper plate. In this structure, some of the connecting terminal groups of the plurality of IC chips are wire-bonded to the wiring patterns on the upper plate, while the other of the connecting terminal groups of the plurality of IC chips pass through the opening hole in the upper plate and are wire-bonded directly to the wiring patterns on the lower plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.