Inventor

Shingo Ichikawa

17Patents
12h-index
30Co-inventors
78Inventor score

Filing activity: Apr 5, 1974 → Dec 20, 2016

Most-cited inventions

PatentTitleAreaCited byStatus
US5108955A Method of making a resin encapsulated pin grid array with integral heatsink Emerging Cross-Sectional Technologies 71 Expired
US5289039A Resin encapsulated semiconductor device Electricity 27 Expired
US5433822A Method of manufacturing semiconductor device with copper core bumps Electricity 27 Expired
US4942453A IC package Electricity 22 Expired
US4026103A Electronic timepiece with digital display means Physics 22 Expired
US5179039A Method of making a resin encapsulated pin grid array with integral heatsink Emerging Cross-Sectional Technologies 21 Expired
US7338118B2 Seat Performing Operations; Transporting 18 Expired
US4868634A IC-packaged device Electricity 13 Expired
US3946592A Digital time error measuring arrangement Physics 13 Expired
US5892448A Electronic clinical thermometer Physics 12 Expired
US5233225A Resin encapsulated pin grid array and method of manufacturing the same Electricity 12 Expired
US5886953A Heavy-load drive apparatus for an electronic watch Physics 12 Expired
US6036797A Process of producing IC cards Emerging Cross-Sectional Technologies 8 Expired
US9731630B2 Seat slide device Performing Operations; Transporting 4 Active
US4764910A Electronic timepiece Physics 3 Expired
US10237525B2 Display device, method for controlling display device, control program, and recording medium Electricity 2 Active
US7595561B2 Semiconductor device including multiple rows of peripheral circuit units Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.