Semiconductor die attach system
US4872047A · kind A · utility
45Cited by
23References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1986 |
| Grant date | Oct 3, 1989 |
| Priority date | — |
| Expiry date | Nov 7, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.