Deepak Mahulikar
82Patents
30h-index
61Co-inventors
91Inventor score
Filing activity: Mar 9, 1984 → Dec 7, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5608267A | Molded plastic semiconductor package including heat spreader | Electricity | 268 | Expired |
| US5578869A | Components for housing an integrated circuit device | Electricity | 197 | Expired |
| US6083840A | Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys | Electricity | 159 | Expired |
| US5399187A | Lead-free bullett | Mechanical Engineering; Lighting; Heating | 115 | Expired |
| US4888449A | Semiconductor package | Emerging Cross-Sectional Technologies | 94 | Expired |
| US4882212A | Electronic packaging of components incorporating a ceramic-glass-metal composite | Emerging Cross-Sectional Technologies | 93 | Expired |
| US5367196A | Molded plastic semiconductor package including an aluminum alloy heat spreader | Electricity | 90 | Expired |
| US5629835A | Metal ball grid array package with improved thermal conductivity | Electricity | 79 | Expired |
| US4897508A | Metal electronic package | Electricity | 77 | Expired |
| US5477008A | Polymer plug for electronic packages | Emerging Cross-Sectional Technologies | 68 | Expired |
| US4939316A | Aluminum alloy semiconductor packages | Emerging Cross-Sectional Technologies | 67 | Expired |
| US5559306A | Electronic package with improved electrical performance | Electricity | 67 | Expired |
| US5043534A | Metal electronic package having improved resistance to electromagnetic interference | Electricity | 60 | Expired |
| US5122858A | Lead frame having polymer coated surface portions | Electricity | 58 | Expired |
| US6447563B1 | Chemical mechanical polishing slurry system having an activator solution | Chemistry; Metallurgy | 57 | Expired |
| US6262477A | Ball grid array electronic package | Electricity | 53 | Expired |
| US5098864A | Process for manufacturing a metal pin grid array package | Emerging Cross-Sectional Technologies | 51 | Expired |
| US5506446A | Electronic package having improved wire bonding capability | Electricity | 49 | Expired |
| US5315155A | Electronic package with stress relief channel | Electricity | 47 | Expired |
| US4872047A | Semiconductor die attach system | Electricity | 45 | Expired |
| US5814759A | Lead-free shot | Mechanical Engineering; Lighting; Heating | 45 | Expired |
| US4821151A | Hermetically sealed package | Electricity | 44 | Expired |
| US5343073A | Lead frames having a chromium and zinc alloy coating | Electricity | 40 | Expired |
| US5066368A | Process for producing black integrally colored anodized aluminum components | Electricity | 40 | Expired |
| US5015803A | Thermal performance package for integrated circuit chip | Emerging Cross-Sectional Technologies | 38 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.