Variable pitch IC bond pad arrangement
US4875138A · kind A · utility
12Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 24, 1988 |
| Grant date | Oct 17, 1989 |
| Priority date | — |
| Expiry date | Jun 24, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The bond pads (22) for a ceramic package (10) are deposited on the pre-fired ceramic at variable pitch with the bond pad widths (47) increasing as a function of the distance (49) of each pad from an alignment point (40), whereby bond pads at the extremity (36) of the package have the largest pad width and pads toward the alignment point (40) of the package have the narrowest width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.