Wire stacked bonding method
US4875618A · kind A · utility
17Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1987 |
| Grant date | Oct 24, 1989 |
| Priority date | — |
| Expiry date | Oct 27, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad, and a second wire is bonded on the position where the first wire has been bonded. Bonding of a subsequent wire is performed in that the wire is stacked and bonded in similar manner mentioned above. Thus a plurality of repair wires can be bonded within one pad even if the pad area is very small.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.