Tositada Netsu
5Patents
5h-index
25Co-inventors
59Inventor score
Filing activity: Oct 27, 1987 → Nov 17, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5276289A | Electronic circuit device and method of producing the same | Electricity | 40 | Expired |
| US5926375A | Surface mounting structure | Emerging Cross-Sectional Technologies | 24 | Expired |
| US4930002A | Multi-chip module structure | Electricity | 20 | Expired |
| US4875618A | Wire stacked bonding method | Electricity | 17 | Expired |
| US5844311A | Multichip module with heat sink and attachment means | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.