Wafer processing apparatus
US4875989A · kind A · utility
32Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1988 |
| Grant date | Oct 24, 1989 |
| Priority date | — |
| Expiry date | Dec 5, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/168
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing apparatus and method for edge-preferential processing of partially fabricated integrated circuit wafers or of other substantially flat and thin workpieces. A plasma remote from the workpiece is used to generate activated species, and a baffle which is in proximity to the wafer face but not in contact with it is used to direct the stream of activated species. This module can be set up to perform both edge bead removal and bake of spun-on photoresist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.