Method and apparatus for application of coatings on substrates
US4877505A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 22, 1988 |
| Grant date | Oct 31, 1989 |
| Priority date | — |
| Expiry date | Jun 22, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/355
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In order to obtain coatings of greater density and compactness than were possible until now when coating substrates with magnetic field-supported cathode sputtering, a given fraction of metal vapor obtained by vaporization of an electric arc discharge from the anode or cathode is deposited on the functional areas of the substrates together with the sputtered material and, specifically, at least 5 atom percent of the total metal fraction of the coating to be deposited averaged over time is applied by vaporization of an electric arc discharge. A suitable vacuum coating installation for carrying out the method has within a vacuum chamber, a device for vaporizing a part of the coating-forming material with an electric arc discharge and an additional device for magnetic field-supported sputtering of another part of the coating-forming material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.