Dam for lead encapsulation
US4881885A · kind A · utility
18Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1988 |
| Grant date | Nov 21, 1989 |
| Priority date | — |
| Expiry date | Apr 15, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus to encapsulate a device and joints coupled to conductive leads with an encapsulating material. A fixture has a recess to hold via a vacuum the device in place. Conduits in the fixture supply air around the device to form an air dam that flows outward around the device and the leads. A nozzle supplies a metered amount of material to the surface of the device. By controlling the temperature of the fixture and/or the air forming the air dam, the flow of material can be confined to the surface of the device and the joints as it cures. The method can also provide encapsulant edge capping to reduce device stresses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.