Peter G. Ledermann
13Patents
12h-index
39Co-inventors
74Inventor score
Filing activity: Apr 29, 1986 → Dec 20, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5117457A | Tamper resistant packaging for information protection in electronic circuitry | Electricity | 253 | Expired |
| US5343366A | Packages for stacked integrated circuit chip cubes | Electricity | 112 | Expired |
| US5028983A | Multilevel integrated circuit packaging structures | Electricity | 59 | Expired |
| US4814855A | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape | Electricity | 51 | Expired |
| US4934309A | Solder deposition system | Electricity | 43 | Expired |
| US5189363A | Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester | Physics | 43 | Expired |
| US4970579A | Integrated circuit package with improved cooling means | Electricity | 39 | Expired |
| US4898117A | Solder deposition system | Electricity | 25 | Expired |
| US4881885A | Dam for lead encapsulation | Electricity | 18 | Expired |
| US5042708A | Solder placement nozzle assembly | Electricity | 18 | Expired |
| US5065932A | Solder placement nozzle with inert cover gas and inert gas bleed | Performing Operations; Transporting | 17 | Expired |
| US6278784A | Intermittent errors in digital disc players | Physics | 17 | Expired |
| US5130781A | Dam for lead encapsulation | Electricity | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.