High temperature post exposure baking treatment for positive photoresist compositions
US4885232A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 17, 1986 |
| Grant date | Dec 5, 1989 |
| Priority date | — |
| Expiry date | Oct 17, 2006 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/168
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention provides a method for producing a photographic element which comprises coating a substrate with a positive working photosensitive composition which composition comprises an aqueous alkali soluble resin, a quinone diazide photosensitizer and a solvent composition, heat treating said coated substrate at a temperature of from about 20.degree. C. to about 100.degree. C. until substantially all of said solvent composition is removed; imagewise exposing said photosensitive composition to actinic radiation; baking said coated substrate at a temperature of from about 120.degree. C. to about 160.degree. C. for from about 15 seconds to about 90 seconds; and removing the exposed non-image areas of said composition with a suitable developer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.