Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process
US4885841A · kind A · utility
18Cited by
7References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 21, 1989 |
| Grant date | Dec 12, 1989 |
| Priority date | — |
| Expiry date | Feb 21, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
During solder-reflow attachment of surface-mount electronic components to a printed circuit board, vibrational energy sufficient to overcome the static coefficient of friction between the leads of a component and their respective connector pads is applied to the board, with the result that the surface tension of the molten solder between the leads and the pads will produce a best-fit alignment of the leads of each component on their corresponding connector pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.