Method for manufacturing plastic encapsulated semiconductor devices
US4888307A · kind A · utility
48Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1987 |
| Grant date | Dec 19, 1989 |
| Priority date | — |
| Expiry date | Aug 27, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for correctly positioning a metallic plate supporting a semiconductor chip in a mold used for encapsulation, wherein according to a first solution, at least a pair of retractable locating pins are utilized together with a lead connected to the supporting plate. The ends of the locating pins are retracted in the final phase of encapsulation, from the surfaces of the plate, whereas in the initial phase they are in direct contact with the surfaces. According to a second solution, a pair of clamping pins are indirectly connected to the plate through the interposition of insulating thicknessings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.