Method for effecting solder interconnects
US4889275A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1988 |
| Grant date | Dec 26, 1989 |
| Priority date | — |
| Expiry date | Nov 2, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.