Inventor · Boca Raton, FL, US

Douglas W. Hendricks

15Patents
10h-index
17Co-inventors
65Inventor score

Filing activity: Nov 16, 1987 → Sep 4, 1997

Most-cited inventions

PatentTitleAreaCited byStatus
US5336931A Anchoring method for flow formed integrated circuit covers Electricity 285 Expired
US5439162A Direct chip attachment structure and method Emerging Cross-Sectional Technologies 131 Expired
US5444303A Wire bond pad arrangement having improved pad density Electricity 51 Expired
US5323947A Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement Emerging Cross-Sectional Technologies 43 Expired
US5436028A Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards Emerging Cross-Sectional Technologies 39 Expired
US5452656A Apparatus for selectively applying solder paste to multiple types of printed circuit boards Emerging Cross-Sectional Technologies 25 Expired
US4889275A Method for effecting solder interconnects Electricity 18 Expired
US5800723A Process for fabricating flex circuits and product thereby Electricity 15 Expired
US5598967A Method and structure for attaching a circuit module to a circuit board Emerging Cross-Sectional Technologies 12 Expired
US5001038A Process for photoimaging a three dimensional printed circuit substrate Electricity 12 Expired
US5679498A Method for producing high density multi-layer integrated circuit carriers Electricity 9 Expired
US6069679A Selective call receiver having a display module with integrated circuits and method therefor Electricity 5 Expired
US5164022A Method and apparatus for applying solder flux Electricity 4 Expired
US5296046A Subliming solder flux composition Electricity 1 Expired
US5716760A Method for plating a substrate to eliminate the use of a solder mask Electricity 1 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.