Solder deposition system
US4898117A · kind A · utility
25Cited by
18References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1988 |
| Grant date | Feb 6, 1990 |
| Priority date | — |
| Expiry date | Apr 15, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an omnidirectional tool for deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.