Patent · US Expired

Electronic module interconnection system

US4899254A · kind A · utility

64Cited by
8References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 22, 1987
Grant dateFeb 6, 1990
Priority date
Expiry dateJul 22, 2007

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F1/20
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

A system interconnects electronic modules with one another, to a power supply and to signal lines through a printed circuit board. The modules are electrically connected to traces on the printed circuit board using blind mateable connectors. EMI shielding plates are mounted to the circuit board at the I/O connectors for the external cables. Guide elements, such as pin and socket guides and printed circuit board edge guides, are mounted to the circuit board to guide the blind mateable connectors. The system eleminates the numerous cables which would otherwise be required. The printed circuit board is mounted within the system housing and acts as an air duct barrier to aid proper air circulation. The circuit board also acts as a structured element helping to stabilize the housing and various module supports and serves as a mounting structure for various elements, such as cooling fans.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.