Plating bath for electrodeposition of aluminum and plating process making use of the bath
US4904355A · kind A · utility
Assignees
Inventor
Key dates
| Filing date | Apr 19, 1989 |
| Grant date | Feb 27, 1990 |
| Priority date | — |
| Expiry date | Apr 19, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In the plating for electrodeposition of aluminum using a mixed molten salt bath comprising an aluminum halide and a quaternary ammonium salt, the mixed molten salt bath comprises from 20 to 80 mol % of the aluminum halide and from 20 to 80 mol % of a 1-alkyl- or 1,3-dialkylimidazolium halide, provided that the alkyl group has 1 to 12 carbon atoms, by the use of which the plating can be carried out at a high current density of not less than 30 A/dm.sup.2 without generation of burnt deposits, which has been difficult to carry out using the conventional molten salt bath. Addition of a halide of an alkali metal or alkaline earth metal, or an organic solvent, to the above plating bath can improve conductivity and also enhance uniform electrodeposition performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.