Plating bath for electrodeposition of aluminum and plating process making use of the bath
US4906342A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Apr 19, 1989 |
| Grant date | Mar 6, 1990 |
| Priority date | — |
| Expiry date | Apr 19, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In the plating for electrodeposition of aluminum using a non-aqueous solution, a plating bath is prepared to comprise a low-melting plating bath, which comprises a molten mixture comprising an aluminum halide and a dialkyl-and/or trialkylpyridinium halide represented by the following formula: ##STR1## wherein R.sup.1 represents an alkyl group having 1 to 12 carbon atoms, R.sup.2 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R.sup.3 represents an alkyl group having 1 to 6 carbon atoms, and X represents a halogen atom; and said alkyl groups each refer to a straight-chain hydrocarbon group, a branched hydrocarbon group, an alicyclic hydrocarbon group, or any of these further partly containing an aromatic hydrocarbon group, by which the bath life, operability in handling, conductivity, and current efficiency can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.