Cooling apparatus and semiconductor device employing the same
US4908695A · kind A · utility
21Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1988 |
| Grant date | Mar 13, 1990 |
| Priority date | — |
| Expiry date | Apr 7, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat conducting member is placed in the space between a semiconductor chip which generates heat and a heat transfer block which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.