Semiconductor bonding means having an improved capillary and method of using the same
US4911350A · kind A · utility
6Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 1989 |
| Grant date | Mar 27, 1990 |
| Priority date | — |
| Expiry date | Mar 24, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding capillary for a bonding process comprises an elongated capillary body having an axial bore through the body for receiving a wire of a predetermined diameter to be bonded, and a working face on one end of the body for applying force to the bonding wire during the bonding process. The working face includes a first surface portion surrounding the bore and having a first radius of curvature, and a second surface portion adjacent to the first surface portion and having a second radius of curvature smaller than the first radius curvature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.