Kouji Araki
8Patents
6h-index
19Co-inventors
56Inventor score
Filing activity: Mar 24, 1989 → Jan 8, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5295044A | Semiconductor device | Electricity | 75 | Expired |
| US5332921A | Resin-seal type semiconductor device | Electricity | 27 | Expired |
| US7391386B2 | Array antenna control device and array antenna device | Electricity | 15 | Expired |
| US5113241A | Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles | Electricity | 11 | Expired |
| US6605868B2 | Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer | Emerging Cross-Sectional Technologies | 9 | Expired |
| US4911350A | Semiconductor bonding means having an improved capillary and method of using the same | Electricity | 6 | Expired |
| US7263766B2 | Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5338392A | Method for manufacturing a laminated plate used in a semiconductor device | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.