Sputtering apparatus for production of thin films of magnetic materials
US4911815A · kind A · utility
10Cited by
1References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1988 |
| Grant date | Mar 27, 1990 |
| Priority date | — |
| Expiry date | Dec 9, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A magnetic film deposition chamber having Helmholtz coils and a preliminary chamber are connected through a gate valve. Two magnetic plates are fixed to the magnetic film deposition chamber near the both ends thereof. Substrates overlying apertures of a substrate holder are moved by a conveyer together with the substrate holder. The conveyor moves from the preliminary chamber to the film deposition chamber through the gate valve. The substrates then positioned over and between the magnetic plates and are located above the target in the magnetic film deposition chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.