Method for manufacturing hybrid integrated circuits
US4914815A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1989 |
| Grant date | Apr 10, 1990 |
| Priority date | — |
| Expiry date | Feb 21, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/12
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a method for manufacturing hybrid integrated circuits, a plurality of circuit patterns are formed on one surface of a board, and a connecting film is stuck onto the other surface of the board. Then, the board is divided into portions having the respective circuit patterns while leaving the connecting film intact and component parts are mounted on the portions. Finally, the individual portions are separated by cutting the connecting film. The circuit patterns may be formed over one surface of the board and covered with a connecting film. The connecting film may be a constituent element of each circuit pattern, such as an insulating layer disposed between conducting layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.