Method of laser drilling fluoropolymer materials
US4915981A · kind A · utility
94Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1988 |
| Grant date | Apr 10, 1990 |
| Priority date | — |
| Expiry date | Aug 12, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/056
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of ablating fluoropolymer composite materials is presented wherein it has been found that small holes (less than 100 .mu.m) can be formed in fluoropolymer composite laminate materials using UV lasers. The resulting holes can be used to produce vias and plated through-holes having smooth side walls with little or no debris or residue remaining in the holes and minimal damage to the polymer. Thus, the vias and plated through-holes can be plated without further cleaning processes. In addition, the holes are formed at a relatively fast rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.