David B. Noddin
20Patents
16h-index
17Co-inventors
74Inventor score
Filing activity: Aug 12, 1988 → Feb 22, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6018196A | Semiconductor flip chip package | Electricity | 145 | Expired |
| US5046238A | Method of manufacturing a multilayer circuit board | Emerging Cross-Sectional Technologies | 136 | Expired |
| US6103992A | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias | Emerging Cross-Sectional Technologies | 130 | Expired |
| US4915981A | Method of laser drilling fluoropolymer materials | Electricity | 94 | Expired |
| US5841102A | Multiple pulse space processing to enhance via entrance formation at 355 nm | Electricity | 74 | Expired |
| US5276955A | Multilayer interconnect system for an area array interconnection using solid state diffusion | Emerging Cross-Sectional Technologies | 64 | Expired |
| US5731047A | Multiple frequency processing to improve electrical resistivity of blind micro-vias | Electricity | 49 | Expired |
| US5965043A | Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias | Electricity | 46 | Expired |
| US5973290A | Laser apparatus having improved via processing rate | Electricity | 34 | Expired |
| US6132853A | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5910255A | Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6127250A | Method of increasing package reliability by designing in plane CTE gradients | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5868950A | Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6184589A | Constraining ring for use in electronic packaging | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6011697A | Constraining ring for use in electronic packaging | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6203891A | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6023041A | Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance | Electricity | 16 | Expired |
| US6130015A | Method for using fiducial schemes to increase nominal registration during manufacture of laminated circuit | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5888630A | Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5879786A | Constraining ring for use in electronic packaging | Emerging Cross-Sectional Technologies | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.