Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities
US4918574A · kind A · utility
0Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1988 |
| Grant date | Apr 17, 1990 |
| Priority date | — |
| Expiry date | Apr 15, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board having a conformal layer of an insulating material separating a circuit core from an adjacent insulating layer is disclosed. The conformal layer encapsulates the substrate and conductive pattern of circuit lines in the circuit core, thereby reducing failures caused by impurities trapped during lamination. The multilayer circuit board is manufactured by coating at least one circuit core with the conformal layer of insulating material before final lamination of the circuit cores into a multilayer circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.