Method and apparatus for vacuum vapor deposition
US4919968A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1988 |
| Grant date | Apr 24, 1990 |
| Priority date | — |
| Expiry date | Mar 2, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
During electric arc discharge discrete points of the cathode surface are so strongly heated that ionized cathode material is volatilized. Use of such hot spots as vapor source for vacuum coating is, however, impaired by the fact that a short time after beginning of the vapor emission from a hot spot molten material in the form of droplets is also hurled away. The invention provides continuous vapor deposition on the cathode surface with a metal compound which can be broken down, by which accelerated migration of the vapor emitting hot spots is forced in such a way that the hot spots migrate away from a particular site before spatter formation starts. The cathode surface is preferentially continuously sputtered so strongly that the metal quantity supplied to it through the metal compound is 12 to 25% of the quantity of metal carried off through vaporization from hot spots. An installation for carrying out the invention includes two cathodes which continuously coat each other in the presence of a gas forming the requisite metal compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.