Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof
US4920074A · kind A · utility
247Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1988 |
| Grant date | Apr 24, 1990 |
| Priority date | — |
| Expiry date | Feb 25, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a surface mount Gull-Wing type resin-encapsulating package for encapsulating a semiconductor chip, wherein the cut face (outer tip end) of each outer lead is formed to have a smaller cross-sectional area than that of each outer lead, for improving the extension of solder to the cut face of that lead. Such relatively smaller cross-sectional area of the outer tip end of each outer lead reduces the exposed area of the lead material when disconnecting the leads from the frame in separating the device from the frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.