Sumio Okada
6Patents
3h-index
24Co-inventors
57Inventor score
Filing activity: Feb 25, 1988 → Mar 24, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4920074A | Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof | Emerging Cross-Sectional Technologies | 247 | Expired |
| US5150193A | Resin-encapsulated semiconductor device having a particular mounting structure | Electricity | 66 | Expired |
| US5304512A | Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process | Emerging Cross-Sectional Technologies | 35 | Expired |
| US11213757B2 | Information processing apparatus, information processing method, and program | Human Necessities | 0 | Active |
| US9652598B2 | Information processing device, control method, and storage medium | Physics | 0 | Active |
| US11146863B2 | Information processing device, information processing method, and moving image distribution system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.