Fluxless soldering process
US4921157A · kind A · utility
72Cited by
5References
43Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1989 |
| Grant date | May 1, 1990 |
| Priority date | — |
| Expiry date | Mar 15, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of soldering without the need for fluxing agents, high temperature, hydrogen, laser excitation or sputtering techniques. The method uses plasma excitation to remove surface oxides from solder surfaces, thereby eliminating the need for post-soldering cleaning in an accurate and efficient manner, resulting in a higher quality and long term reliability solder joint. In addition, serious environmental problems caused by cleaning solvents are avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.