Module and a substrate for the module
US4922377A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1988 |
| Grant date | May 1, 1990 |
| Priority date | — |
| Expiry date | Nov 16, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a module which mounts a plurality of semiconductor devices and to a module substrate that interconnect the semiconductor devices. This invention has the testing and engineering change pads on the underside of the substrate. This arrangement results in the advantages of: providing a sufficient area for the testing and engineering change pads; improving the package density of semiconductor devices, which in turn leads to higher computation speed; and eliminating the need for a special cooling system during the module testing, simplifying the process of testing. Furthermore, since the signal joint terminals to the semiconductor chips are provided on the surface of the substrate on which the semiconductor chips are mounted and since the power bus joint terminals are provided around the chips on the semiconductor chip-mounting surface of the substrate, it is possible to realize a high density package with high reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.